Product and Technology Demonstrators

Performing object movements in all six degrees of freedom is necessary in many applications. The compact, parallel-kinematic P-616KLTS NanoCube serves all six degrees of freedom and opens up many new possibilities for the assembly and adjustment of demanding structures.

Gyroscopic instruments, i.e. Gyroscopes, can detect and measure a rotary motion or acceleration of the external reference system in relation to the rotating mass. For example, built into theodolites they are used for precise measurements in geodesy, mining, or geology. Due to their properties, gyroscopes are also used for active attitude control in aerospace and marine applications.

Taking sharp pictures despite poor lighting conditions, taking snapshots without blurring, recognizing traffic signs or road markings in driver assistance systems, or identifying dangerous situations in surveillance systems - all of this is possible today with the help of modern cameras. But how good is the still and video image quality of a camera or smartphone?

Fast and reliable measurement of the surface profile of smallest components and features places high demands on the motion and control systems as well as on the sensor technology: End products must meet the requirements regarding functionality and quality.

Optical inspection is an essential process in industrial quality assurance. Optical inspection systems, which are used in industrial environments, should provide reliable and repeatable measurement results and enable high throughput rates.

Superresolution microscopy requires precise, reliable, and reproducible sample positioning, objective alignment, and imaging system integration. With its advanced piezo-driven technology, PI’s ultrasound-based microscope platform offers exceptional precision, making it the perfect choice for demanding tasks in modern microscopy.

The entire chip manufacturing process consists of 400 to 800 production steps. At all critical points in the manufacturing process, inspection processes are essential to ensure the high quality and reliability of the final products.

Efficient wafer inspection and metrology are essential for ensuring a stable, high-performance semiconductor manufacturing process. With up to 800 complex production steps, semiconductor fabrication demands precise inspection and metrology at every critical stage to guarantee the highest levels of quality and yield.

Efficient wafer inspection and metrology are essential in semiconductor manufacturing to prevent yield loss. Achieving this requires precise wafer positioning, which enables fast and reliable analysis of defects and particles at every production stage.

In the production of (micro)chips, it is necessary to separate the individual dies from the wafer. Stealth laser dicing involves creating a modified layer within the wafer by focusing a laser below the surface, then using a tape expander to separate the chips.

When laser drilling the smallest high-density holes, many factors will impact the result: cone shape control as well as spot size and wavelength of the laser. Fast and precise positioning of the workpiece, the laser head, and the laser focus height are equally important.

For the safe and reliable operation of sensitive electronic components or assemblies, the components’ housing must be sealed hermetically to protect the microsystem from damage caused by contaminants seeping in. Using lasers for seam formation enables high welding speeds, as well as fine welding seams with narrow welding radiuses.

The processing of high-density structures over large areas such as laser drilling or laser marking of PCBs requires solutions that provide high precision and high throughput. The combination of multi-axis positioning systems with a highly dynamic galvanometer scanner can address the needs of industrial production.

Manufacturing chips and microchips involves cutting the wafers, using a process known as wafer dicing, into small square or rectangular “chips” or “die”. Typical challenges to consider in wafer dicing applications are: To position the cut accurately, to minimize the losses of material, and to minimize distortions of the components.

Electronic devices are becoming smaller, more complex, operate in different environments, and include several types of components that require tactile, optical, and electronic testing methods.

Reducing design and development time is a decisive competitive factor in precision automation. This is why companies striving for optimum performance in areas such as laser processing or metrology should rely on a powerful, well-coordinated system. PI supports this approach with the preconfigured X-417 Integrated Multi-Axis System (IMAS).

When confronted with health problems, medical technology today makes it possible for implants, for example pacemakers or insulin pumps, to perform important functions. Such implants are highly complex systems consisting of electrical and electronic components. Hermetic sealing, which keeps the microsystem and the surrounding tissue reliably separated from each other, is necessary for safe and...

Lasers are used today in a wide variety of industrial applications in order to further optimize production processes and guarantee high workpiece quality. Laser machining processes can as well be significantly improved by high-frequency oscillation of the laser beam in the XY plane.

To protect sensitive electronic components from contaminants seeping in and to ensure safe and reliable operation, the components’ housing must be sealed hermetically. Using a laser source as a tool provides high welding speeds and produces fine welding seams with narrow welding radiuses.

Machining platforms for creating tiny geometries in the micron range demand motion systems that provide a consistent, accurate and dynamic processing in multiple dimensions.

Optical inspection is an essential process in industrial quality assurance. Optical inspection systems, which are used in industrial environments, should provide reliable and repeatable measurement results and enable high throughput rates.

Piezoelectric or electromagnetic Fast Steering Mirrors (FSM) from PI provide angular resolution down to the nanorad scale with a mechanical bandwidth reaching up to the kHz range. These mirrors effectively compensate for common disturbances in various applications.

Performing object movements in all six degrees of freedom is necessary in many applications. The compact, parallel-kinematic P-616KLTS NanoCube serves all six degrees of freedom and opens up many new possibilities for the assembly and adjustment of demanding structures.

If a dimension between two components or subsystems inside precision machines or in complex test assemblies changes, readjustment may often be necessary. PIRest Active Shims, the piezo-based „washers“, offer a simple solution for it.