The setup for multi-channel automated fiber assembly, based on the proven double-sided F-712.HA2 fiber alignment system and PI´s multi-axis gantry system, offers an idea for further workflow automation.

PI’s optimization technology has proven to dramatically improve production economics in processes as diverse as photonics wafer probing, device packaging, chip testing, and even laser and optical equipment manufacturing. The combination of blazing speed, nanoscale performance, and industrial robustness reduces costs and improves yield worldwide.

Performing object movements in all six degrees of freedom is necessary in many applications. The compact, parallel-kinematic P-616KLTS NanoCube serves all six degrees of freedom and opens up many new possibilities for the assembly and adjustment of demanding structures.

Gyroscopic instruments, i.e. Gyroscopes, can detect and measure a rotary motion or acceleration of the external reference system in relation to the rotating mass. For example, built into theodolites they are used for precise measurements in geodesy, mining, or geology. Due to their properties, gyroscopes are also used for active attitude control in aerospace and marine applications.

Taking sharp pictures despite poor lighting conditions, taking snapshots without blurring, recognizing traffic signs or road markings in driver assistance systems, or identifying dangerous situations in surveillance systems - all of this is possible today with the help of modern cameras. But how good is the still and video image quality of a camera or smartphone?

Optical inspection is an essential process in industrial quality assurance. Optical inspection systems, which are used in industrial environments, should provide reliable and repeatable measurement results and enable high throughput rates.

Precision positioning is the key element in all types of microscopy. High-resolution microscopy must be capable of accurate and reproducible positioning of imaging elements and samples.

The processing of high-density structures over large areas such as laser drilling or laser marking of PCBs requires solutions that provide high precision and high throughput. The combination of multi-axis positioning systems with a highly dynamic galvanometer scanner can address the needs of industrial production.

Manufacturing chips and microchips involves cutting the wafers, using a process known as wafer dicing, into small square or rectangular “chips” or “die”. Typical challenges to consider in wafer dicing applications are: To position the cut accurately, to minimize the losses of material, and to minimize distortions of the components.

Electronic devices are becoming smaller, more complex, operate in different environments, and include several types of components that require tactile, optical, and electronic testing methods.

The S-355 tip/tilt platform is versatile in use thanks to its parallel-kinematic, multi-axis design and its flexure guides, which are free of maintenance, friction, and wear. It allows fast, high-dynamics motion with high precision.

Performing object movements in all six degrees of freedom is necessary in many applications. The compact, parallel-kinematic P-616KLTS NanoCube serves all six degrees of freedom and opens up many new possibilities for the assembly and adjustment of demanding structures.

If a dimension between two components or subsystems inside precision machines or in complex test assemblies changes, readjustment may often be necessary. PIRest Active Shims, the piezo-based „washers“, offer a simple solution for it.