See the Latest Motion Solutions for Semiconductor Bonding, Packaging, Inspection & Metrology at SEMICON West 2026

Surface Shaping for Wafers & Optics

Active Wafer Chuck

  • 200μm piezo stroke for bow and warpage compensation using first 10 Zernike modes, or freely selectable
  • 6μm short-wave correction for local deformation control with 15mm actuator pitch

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Bonding, Packaging, Metrology

6-DoF MagLev Wafer Stage

  • Force Controlled Bonding Capability: >100N, up to 1mm Z Travel
  • Tavel: X 400mm; Y: 400μm; Z: to 1mm; ӨXY: 1mrad; ӨZ: 2mrad
  • Acceleration: 6g
  • Stability XYZ: <2nm; ӨXYZ <20nrad
  • Repeatability: double digit nm

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For Wafer Inspection & Metrology

6-DoF MagLev Rotary Stage

  • Rotation Range ӨZ: >360, ӨXY: 0.5mrad
  • Payload: up to 25kg
  • Z-Stability: <3nm
  • Tilt Error: <50nrad

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High-Performance Scanning & Metrology

High-Speed Air Bearing XY Gantry

  • Travel Range: 500x500mm
  • Acceleration: 2g
  • Max Velocity: 2m/s
  • Accuracy: 0.1μm
  • Pitch/Yaw: 10/2μrad

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Inspection and Metrology

6-DoF Sub-Nanometer AFM Scanner  

  • Travel: X, Y: 50mm; Z: 50μm; ӨXYZ: 2mrad
  • Resolution: 50pm / 0.5nrad

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Silicon Photonics Wafer Testing & Packaging

6-DoF Photonics Alignment Systems

  • Patented Alignment Algorithms – Up to 100X Faster
  • Nanometer Resolution
  • Ideal for Array Alignment
  • Ideal for Wafer Handlers

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Advanced Motion Solutions for Semiconductor Bonding, Packaging, Inspection & Metrology

PI Wins Best Poster Presentation Award!



Additional Semicon Resources

Physik-Instrumente-Meeting

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