Testing SiPh chips is crucial to reducing costs as faulty chips are identified and removed from the continuing manufacturing process. Precise alignment of signal-carrying glass fibers in six DOF is necessary to perform this task.
Lasers are indispensable tools in industrial materials processing including drilling, micromachining, welding, cutting, and ablation, but its positioning and motion control are key components to using one properly.
Precision, throughput, reliability, and flexibility of production systems are becoming more decisive at a wafer and chip level, not to mention at printed circuit board level. Each positioning and motion task in the process must meet these requirements.