High Performance Nanopositioning Motion Control for Semiconductor Test & Metrology at 2022 Semicon West
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Events - PI (Physik Instrumente) L.P.

High Performance Nanopositioning Motion Control for Semiconductor Test & Metrology at 2022 Semicon West

See the latest developments in multi-axis air-bearing stages, direct-drive wafer stages, beam control systems and sub-nanometer resolution piezo stages backed by decades of PI’s precision motion experience.

PI’s booth at the 2022 Semicon West will feature new high precision multi-axis motion systems for Wafer Inspection and Metrology along with high speed piezo mirror mounts for laser beam delivery and fast response focus scanners for surface metrology. Held in San Francisco, SemiconWest offers hands-on and virtual access this year to the latest design and development systems and services created for the microelectronics supply chain.

PI’s high precision solutions and motion systems find applications in water inspection and metrology, wafer stealth dicing, nano-lithography, laser optics, and mask inspection. PI focuses on global growth markets such as Industrial Automation, Semiconductor Manufacturing, Silicon Photonics, Quantum Computing, High Resolution Microscopy, and Life Sciences.

Can’t make it to San Francisco? You can take a look at a variety of performance automation, photonics, and nanopositioning applications covered by PI system technologies.

Another way to learn about the latest motion control technologies is by signing up to one of our precision motion design webinars:

On-Demand Webinars

Physik Instrumente Wafer and Substrate Inspection

Film Metrology in Wafer Inspection

PI is currently developing motion solutions for wafer positioning to facilitate the measurement of crucial wafer attributes.

Physik Instrumente – Wafer Inspection

Wafer Inspection and Metrology

The entire chip manufacturing process consists of 400 to 800 production steps. At all critical points in the manufacturing process, inspection processes are essential to ensure the high quality and reliability of the final products.

Physik Instrumente – Wafer Dicing

Wafer Stealth Dicing

In the production of chips and microchips, it is necessary to separate the individual dies from the wafer. In this process, quality and precision are crucial for all further post-fab operations. Laser dicing has therefore become the preferred dicing technology.

Solutions for Semiconductor Manufacturing

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